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Passivation of the grain boundary electrical activity in multicrystalline silicon: aluminum treatment efficiency

Identifieur interne : 000367 ( France/Analysis ); précédent : 000366; suivant : 000368

Passivation of the grain boundary electrical activity in multicrystalline silicon: aluminum treatment efficiency

Auteurs : N. M'Gafad [Maroc] ; H. Amzil [Maroc] ; D. Sayah [Maroc] ; D. Ballutaud [France] ; M. Barbé [France]

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RBID : ISTEX:DB751D511F33990392B13175D4D68293DCEB3CD4

Abstract

The electrical activity of grain boundaries in multicrystalline silicon has been investigated using electron beam induced current (EBIC) contrast imaging and potential barrier height and interface state density calculation from I–V and C–V measurements. It is shown that 1 μm evaporated aluminum layer deposited on the back surface of a silicon sample, followed by annealing at 850°C for 30 min, reduces the electrical activity of grain boundaries: the interface states density and the EBIC contrast associated with the recombination at grain boundaries decrease. It is also established that the efficiency of aluminum passivation depends on the cooling rate after the diffusion of aluminum at 850°C. The gettering mechanism is discussed.

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DOI: 10.1016/S0038-1101(99)00011-8


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ISTEX:DB751D511F33990392B13175D4D68293DCEB3CD4

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